Question

Qual das alternativas apresenta os empacotamentos em ordem crescente de eficiência de empacotamento?
A) DIP < BGA < Chip Scale Package < Stacked Die Package < Wafer Level Package.
B) BGA < DIP < Chip Scale Package < Stacked Die Package < Wafer Level Package.
C) DIP < BGA < Chip Scale Package < Wafer Level Package < Stacked Die Package.
D) BGA < DIP < Chip Scale Package < Wafer Level Package < Stacked Die Package.
E) DIP < BGA < Stacked Die Package < Chip Scale Package < Wafer Level Package.

Accepted Answer

Alternativa C: DIP < BGA < Chip Scale Package < Wafer Level Package < Stacked Die Package.

QuestãoCentro Nacional de Tecnologia Eletrônica Avançada S.A. - CEITEC - Analista Administrativo Área Engenharia Física (ETEA - ENCAPS)

Enunciado